ZeroFlap MicroLED
Interconnect Technology

Credo microLED technology will address high-throughput connnectivity requirements up to 30m distance in AI data centers. Based on a dense array of emitters and photo-detectors coupled with flexible and light fiber bundles, solutions based on this technology will deliver reliability, power efficiency, and bandwidth scalability for scale-out, scale-up, and scale-in applications.

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Advantages of microLED interconnects

MicroLED Interconnects Enable Redundant, Low‑Power Optical Links

Reliability

Building on the ZeroFlap link-monitoring and events-logging features, Credo microLED solutions will deliver hitless failover of optical channels.

Power Efficiency

Credo MicroLED solutions consume almost zero current in the off-state and use the wide-parallel approach to optical connectivity with simple NRZ modulation, resulting in low power.

Bandwidth Density

By increasing emitter data rates and leveraging dense two-dimensional array formats, Credo microLED solutions scale the bandwidth densities required by AI fabrics through co-packaged I/O.

Built to Scale

Credo’s active LED Cables (ALCs) extend reach up to 30 meters with dramatically reduced bulk—without sacrificing AEC‑class reliability. Powered by microLED technology, co‑packaged connectivity enables ultra‑dense bandwidth and exceptional power efficiency, delivering a compact, resilient, and future‑ready interconnect solution.

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Zero Interruptions.

ZeroFlap performance is reinforced by monitoring LED channels and seamlessly transitioning any weakening channels to a spare one while ensuring zero data loss.

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30m Reach with 75% Less Bulk.

Active LED Cables (ALCs) can achieve up to 30m reach with 75% less cable bulk while offering AEC-like reliability.

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Integrated Connectivity That Scales.

MicroLED technology can deliver co-packaged connectivity at high-bandwidth density and power efficiency.

Active LED Cables (ALCs): Extending AEC-Class Reliability to 30 Meters

Combining Credo’s connectivity solution expertise with the new microLED technology delivers AEC-class reliability in a 75% thinner optical cable, reaching up to 30m – making them ideal for row-scale AI connectivity where traditional pluggable optics add cost, power, and reliability risk.

microLEDs for AI Infrastructure Applications

Scale-up and scale-out networks are getting faster and denser while demanding greater reliability and power-efficiency. Scale-in interconnects are emerging as a new category of ultra-high throughput, chip-to-chip connections.

Scale-out networks

Scale-out networks connect dense GPU clusters and enable pipeline parallelism. Credo’s Active LED Cables extend reach while reducing bulk and power without sacrificing reliability.

Scale-up networks

Scale-up networks are ~10x denser than scale-out and currently rely on passive copper within the rack. As they extend to row scale (10-30m), they will require ultra-reliable and low-power interconnects, making microLED-based solutions ideal candidates.

Scale-in interconnects

Scale-in interconnects require ultra-high throughput and are ~10x denser than scale-up. These chip-to-chip interconnects between GPUs or GPUs and memory may need only up to 1m reach. MicroLED-based interconnects can scale down in size and deliver the densities needed for this emerging application.

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Blog

MicroLED Technology Brings Reliability, Longer Reach and Lower Power for AI Scale- Out and Scale-Up Architectures