New Albany, IN: Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, and Credo, a global innovation leader in high performance, low power connectivity solutions for 100 Gbps, 200 Gbps, 400 Gbps, and 800 Gbps port enabled networks, proudly announce the global premiere of a 56 Gbps PAM4 Active Product Demonstrator at DesignCon 2019 Booth 737. DesignCon 2019 is taking place January 29 - 31 at the Santa Clara Convention Center in Santa Clara, CA.
The 56 Gbps PAM4 Active Product Demonstrator combines Samtec’s comprehensive portfolio of high-performance interconnect in a typical data center chassis application with Credo’s production retimer devices featuring the industry’s lowest power, mixed-signal 56 Gbps PAM4 SerDes technology. The system includes more than 100 channels of 56 Gbps PAM4 data offering 5.8 Tbps aggregate throughput.
Samtec Products featured in the 56 Gbps PAM4 Active Product Demonstrator include:
Credo Products featured in the 56Gbps PAM4 Active Product Demonstrator include:
For more information on Samtec’s 56 Gbps PAM4 Product Demonstrator, please visit www.samtec.com/s2s or e-mail SIG@samtec.com.
About Samtec, Inc.:
Founded in 1976, Samtec is a privately held, $822 MM global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. With 40+ location severing approximately 125 countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit http://www.samtec.com.
About DesignCon
DesignCon is the world’s premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and two-day expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry’s leading experts and solutions providers. More information is available at: www.designcon.com, DesignCon is organized by UBM, which in June 2018 combined with Informa PLC to become a leading B2B information services group and the largest B2B Events organizer in the world. To learn more and for the latest news and information, visit www.ubm.com and www.informa.com.
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Samtec, Inc.
P.O. Box 1147
New Albany, IN 47151-1147
USA
Phone: 1-800-SAMTEC-9 (800-726-8329)
www.samtec.com