Products - Credo

bg-cover

bg-cover

dotted background

1.6T ZeroFlap Optics – Accelerate Time to First Token

The new 1.6T ZeroFlap optical transceivers are the first to combine Credo’s optical DSP and Kfir200 silicon photonics PIC in a single device. Built for AI fabric reliability, these transceivers use advanced telemetry and in-band communication to identify weak optical links and address them before they become network-impacting problems.

Play video

Products

Credo high-speed copper and optical interconnect solutions deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI.

ZeroFlap AECs

Higher hardware reliability, and improved signal integrity and reach, with zero soft link flaps.

AEC 800G@2x

ZeroFlap Optical Transceivers

New ZeroFlap optical transceivers utilize Credo’s PILOT platform to address optical transceiver reliability in AI networks.

Product_Credo 1.6T ZF Optics Image

ZeroFlap ALC with Micro-Emitter Optics

Credo’s active light cable (ALC) is the industry’s first row-scale, wide-parallel optical interconnect solution built for AI scale-out and front-end networks.

microLED products

Silicon Photonics

Enables high‑speed, low‑power connectivity for data center and AI optics.

SiPho PIC_Product Image

Optical DSPs

Full-featured DSPs that support 50G to 1.6T PAM-4 optical transceivers and active optical cables.

Credo-Cardinal Optical-DSP

OmniConnect

Overcomes the memory bottlenecks in AI inference workloads.

Credo-OmniConnect-Weaver

PCIe Retimers

Extends PCIe/CXL trace length for compute, network, CXL memory and NVMe SSD connectivity.

c6b8ad828a50a26ada673bb4c71f6dd72ffbfe83

Retimers & MACsec

Multiprotocol retimers, gearboxes and MACsec devices for AI scale-up and scale-out interconnect applications.

Blue Heron_AI Scale Up

IP and Chiplets

Credo SerDes IP solutions span 28G to 224G signaling and are manufactured in mature process nodes.

Teslawafer-1

gradient background

Solutions

ZeroFlap

Solving the link flap problem and improving link reliability

AI Infrastructure

Enabling new scale-up and scale-out AI cluster architectures

PILOT

Rich telemetry, SDK debug platform for next-generation data centers

Credo’s Unique Methodology

Our three-tiered innovation framework is based on our belief that the whole is greater than the sum of its parts.

Core Technology

Our industry-leading SerDes technology is the foundation for Credo high-speed connectivity solutions.

Architecture

Advanced IC design enables us to deliver leading-edge performance and power.

System-level Approach

The foundation for inventing market-disrupting product categories like AECs and PILOT.