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PRESS RELEASES
Welcome to Credo’s News Room. Select an article or search by product.
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HiWire AEC
Feb. 1, 2024
Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology
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Aug. 17, 2022
Credo Launches Comprehensive Family of 112G PAM4 SerDes IP for TSMC N5 and N4 Process Technologies
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Jun. 2, 2022
Credo Introduces Industry Leading 40Gbps PAM3 SerDes Technology To Address New Markets Requiring High-speed, Low-Power Connectivity
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Dec. 1, 2021
New Credo 3.2Tbps DSP Connectivity Chiplet with 56Gbps Lane Rates to Accelerate Time-to-Market for New Multi-chip Module ASICs
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May. 19, 2021
Credo Announces 3.2Tbps XSR-Enabled High-Speed Connectivity Chiplet with 112Gbps Lane Rates
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May. 24, 2019
Credo First to Demonstrate 7nm, 112G XSR SerDes
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Oct. 29, 2018
Credo First to Publicly Demonstrate 112G SerDes in 7nm at TSMC’s 2018 China OIP Forum
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Oct. 3, 2018
Credo to Showcase 56Gbps and 112Gbps SerDes at TSMC’s 2018 Open Innovation Platform Ecosystem Forum
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