ZeroFlap ALCs with Micro-Emitter Optics

Credo’s active light cable (ALC) is the industry’s first row-scale, wide-parallel optical interconnect solution built for AI scale-out and front-end networks. It is built on a dense array of micro-emitters (microVCSELs or microLEDs) and photodetectors bridged by light and flexible fiber bundles.

Addressing high-throughput connectivity requirements up to 50m distance in AI data centers, the ALC closes the underserved mid-reach gap, extending the field-proven ZeroFlap reliability of Credo AECs to row scale in a cable that’s 10x lighter, at under 12W per end.

Industry’s First Row-Scale, Wide-Parallel Optical Interconnect

ZeroFlap ALCs Deliver Redundancy-enabled, Low-Power Optical Links

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Reliability

Building on the ZeroFlap link-monitoring and events-logging features, Credo micro-emitter solutions will deliver hitless failover of optical channels to built-in spares.

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Power Efficiency

Credo ZeroFlap ALCs avoid complex DSP for signal recovery and use the wide-parallel approach to optical connectivity with simple NRZ modulation, resulting in low power.

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Bandwidth Density

By increasing emitter data rates and leveraging dense two-dimensional array formats, future iterations of Credo ZeroFlap ALCs scale seamlessly to support higher throughputs.

Active Light Cables (ALCs): Extending Copper-Class Reliability to 50 Meters

Combining Credo’s connectivity solution expertise with the new micro-emitter technology delivers copper-class reliability in a 10x lighter optical cable, reaching up to 50m – making them ideal for row-scale AI connectivity where traditional pluggable optics add cost, power, and reliability risk.

Micro-Emitters Built for the Next Decade of AI Infrastructure

Scale-up and scale-out networks are getting faster and denser while demanding greater reliability and power efficiency. Scale-in interconnects are emerging as a new category of ultra-high throughput, chip-to-chip connections.

Scale-out networks

Scale-out networks connect dense GPU clusters and enable pipeline parallelism. Credo’s ALCs extend reach while reducing bulk and power without sacrificing reliability.

Scale-up networks

Scale-up networks are ~10x denser than scale-out and currently rely on passive copper within the rack. As they extend to row scale (10-30m), they will require ultra-reliable and low-power interconnects, making micro-emitter-based solutions ideal candidates.

Scale-in interconnects

Scale-in interconnects require ultra-high throughput and are ~10x denser than scale-up. These chip-to-chip interconnects between GPUs or GPUs and memory may need only up to 1m reach. Micro-emitter-based interconnects can scale down in size and deliver the densities needed for this emerging application.

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