Built to Scale
Credo’s ZeroFlap ALCs extend reach up to 50 meters with dramatically reduced bulk—without sacrificing copper-class reliability. Powered by micro-emitter technology, Credo’s roadmap will support near-package and co-packaged connectivity solutions delivering ultra-dense bandwidth, exceptional power efficiency, and resilient future-ready connectivity.
Micro-Emitters Built for the Next Decade of AI Infrastructure
Scale-up and scale-out networks are getting faster and denser while demanding greater reliability and power efficiency. Scale-in interconnects are emerging as a new category of ultra-high throughput, chip-to-chip connections.
Scale-out networks
Scale-out networks connect dense GPU clusters and enable pipeline parallelism. Credo’s ALCs extend reach while reducing bulk and power without sacrificing reliability.
Scale-up networks
Scale-up networks are ~10x denser than scale-out and currently rely on passive copper within the rack. As they extend to row scale (10-30m), they will require ultra-reliable and low-power interconnects, making micro-emitter-based solutions ideal candidates.
Scale-in interconnects
Scale-in interconnects require ultra-high throughput and are ~10x denser than scale-up. These chip-to-chip interconnects between GPUs or GPUs and memory may need only up to 1m reach. Micro-emitter-based interconnects can scale down in size and deliver the densities needed for this emerging application.