A silicon photonics solution that improves link performance, reduces system cost and power, and supports volume ramp.
Boost Optical Performance
L3C™ improves laser-to-chip coupling efficiency, resulting in lower optical loss and improved link margin.
Cut Your BOM Cost
Fewer, simpler lasers reduce BOM costs while improving yield.
Reduce Power and Cooling
Reduced laser count and lower current drive cut overall power consumption.
Deploy an End-to-End SiPho Platform
Complete SiPho platform with active and passive components, laser integration, and fiber coupling.
Credo SiPho Products
Our silicon photonics chips deliver the optical connectivity that data centers and AI infrastructure demand. Built on proprietary L3C™️ laser attach technology, our PICs scale across every transceiver architecture, thermal environment, and reach requirement — so you get the exact solution your application needs, without compromise.
Oz8
Optical Interface
DR8 (8x200G)
Data Rate
1.6T
Integrated / External Laser
Integrated
Engine / Chip
Engine
Application
1.6T-DR8 QSFP and OSFP
Short Reach AOC or Transceivers applications
FRO, LRO and LPO applications
Immersion cooling
Oz4
Optical Interface
DR4 (4X200G)
Data Rate
800G
Integrated / External Laser
Integrated
Engine / Chip
Engine
Application
800G – DR4 QSFP and OSFP
Short Reach AOC or transceiver applications
FRO, LRO and LPO applications
Carmel8
Optical Interface
DR8 (8X100G)
Data Rate
800G
Integrated / External Laser
Integrated
Engine / Chip
Engine
Application
800G – DR8 QSFP and OSFP
Short Reach AOC or transceiver applications
FRO, LRO and LPO applications
Carmel4
Optical Interface
DR4 (4X100G)
Data Rate
400G
Integrated / External Laser
Integrated
Engine / Chip
Engine
Application
400G – DR4 QSFP and OSFP
800G-DR8/DR8+ QSFP or OSFP using two Carmel4 devices
Short Reach AOC or transceiver applications
FRO, LRO and LPO applications
Kfir
Optical Interface
DR8 (8X100G)
Data Rate
800G
Integrated / External Laser
External
Engine / Chip
Chip
Application
800G-DR8 QSFPDD and OSFP
Short Reach AOC or transceiver application
FRO, LRO and LPO applications
Kfir200
Optical Interface
DR8 (8X200G)
Data Rate
1.6T
Integrated / External Laser
External
Engine / Chip
Chip
Application
1.6T -DR8 QSFPDD and OSFP
Short Reach AOC or transceiver application
FRO, LRO and LPO applications
Tamar
Optical Interface
2xFR4 (8X100G)
Data Rate
800G
Integrated / External Laser
External
Engine / Chip
Chip
Application
800G-2XFR4 for QSFP or OSFP up to 2km
Fully retimed (DSP) for FRO, LRO and LPO applications
Tamar200
Optical Interface
2xFR4 (8X200G)
Data Rate
1.6T
Integrated / External Laser
External
Engine / Chip
Chip
Application
1.6T – 2xFR4 for OSFP
Fully Retimed (DSP) for FRO, LRO and LPO applications
Everything You Need to Build Next-Gen Optical Links
Laser Integration Made Simple
Seamless L3C™ integration with off-the-shelf lasers—less complexity, faster production.
High-Speed Performance Built In
Fast, reliable modulators and detectors for high data rates and wide wavelength support.
End-to-End Solution
Essential optical building blocks—waveguides, splitters, combiners, and WDM components—for flexible, scalable design.
Designed to Scale, Proven to Perform
Modular building blocks enable high-performance systems that are easy to integrate, scale, and optimize for next-generation optical communications.
Making Silicon Photonics Simpler, More Efficient, and More Scalable
Getting light into a photonic chip is one of the hardest problems in silicon photonics, and it has a big impact on performance, cost, and energy use. Low Loss Laser Coupling (L3C™) technology provides an innovative approach to integrating off‑the‑shelf lasers directly onto silicon, delivering measurable advantages in performance, cost, power efficiency, and scalability.
L3C creates a smarter, more efficient way to connect lasers to photonic chips—unlocking better performance while making systems easier and more cost-effective to build.
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