What sets Credo’s silicon
photonics apart?
Credo has built key proprietary IPs that push silicon photonics performance further — from a high-speed modulator enabling 400G, 800G, and 1.6T today, with a clear path to 3.2T and 6.4T, to ultra-low-loss laser and fiber coupling technology that cuts power consumption without compromising performance at scale.
A silicon photonics solution that improves link performance, reduces system cost and power, and supports volume ramp.
Boost Optical Performance
L3C™ improves laser-to-chip coupling efficiency, resulting in lower optical loss and improved link margin.
Cut Your BOM Cost
Fewer, simpler lasers reduce BOM costs while improving yield.
Reduce Power and Cooling
Reduced laser count and lower current drive cut overall power consumption.
Deploy an End-to-End SiPho Platform
Complete SiPho platform with active and passive components, laser integration, and fiber coupling.
Credo SiPho Products
Our silicon photonics chips deliver the optical connectivity that data centers and AI infrastructure demand. Built on proprietary L3C™️ laser attach technology, our PICs scale across every transceiver architecture, thermal environment, and reach requirement — so you get the exact solution your application needs, without compromise.
Kfir200
Optical Interface
DR8 (8X200G)
Data Rate
1.6T
Application
1.6T-DR8 for QSFPDD/OSFP | Short-Reach AOC/transceiver | FRO/LRO/LPO
Integrated / External Laser
External
Engine / Chip
Chip
Kfir
Optical Interface
DR8 (8X100G)
Data Rate
800G
Application
800G-DR8 for QSFPDD/OSFP | Short-Reach AOC/transceiver | FRO/LRO/LPO
Integrated / External Laser
External
Engine / Chip
Chip
Tamar200
Optical Interface
2xFR4 (8X200G)
Data Rate
1.6T
Application
1.6T–2xFR4 for OSFPFully Retimed (DSP) for FRO/LRO/LPO
Integrated / External Laser
External
Engine / Chip
Chip
Tamar
Optical Interface
2xFR4 (8X100G)
Data Rate
800G
Application
800G-2xFR4 for QSFP/OSFP (up to 2km) | Fully Retimed (DSP) for FRO/LRO/LPO
Integrated / External Laser
External
Engine / Chip
Chip
Oz8
Optical Interface
DR8 (8x200G)
Data Rate
1.6T
Application
1.6T-DR8 for QSFP/OSFP | Short-Reach AOC/Transceivers | FRO/LRO/LPO | Immersion cooling
Integrated / External Laser
Integrated
Engine / Chip
Engine
Oz4
Optical Interface
DR4 (4X200G)
Data Rate
800G
Application
800G-DR4 for QSFP/OSFP | Short-Reach AO/transceiver | FRO/LRO/LPO
Integrated / External Laser
Integrated
Engine / Chip
Engine
Carmel8
Optical Interface
DR8 (8X100G)
Data Rate
800G
Application
800G-DR8 for QSFP/OSFP | Short-Reach AOC/transceiver | FRO/LRO/LPO
Integrated / External Laser
Integrated
Engine / Chip
Engine
Carmel4
Optical Interface
DR4 (4X100G)
Data Rate
400G
Application
400G-DR4 for QSFP/OSFP | 800G-DR8/DR8+ for QSFP/OSFP (2 Carmel4 devices) | Short-Reach AOC/transceiver | FRO/LRO/LPO
Integrated / External Laser
Integrated
Engine / Chip
Engine
Everything You Need to Build Next-Gen Optical Links
Laser Integration Made Simple
Seamless L3C™ integration with off-the-shelf lasers—less complexity, faster production.
High-Speed Performance Built In
Fast, reliable modulators and detectors for high data rates and wide wavelength support.
End-to-End Solution
Essential optical building blocks—waveguides, splitters, combiners, and WDM components—for flexible, scalable design.
Designed to Scale, Proven to Perform
Modular building blocks enable high-performance systems that are easy to integrate, scale, and optimize for next-generation optical communications.
Making Silicon Photonics Simpler, More Efficient, and More Scalable
Getting light into a photonic chip is one of the hardest problems in silicon photonics, and it has a big impact on performance, cost, and energy use. Low Loss Laser Coupling (L3C™) technology provides an innovative approach to integrating off‑the‑shelf lasers directly onto silicon, delivering measurable advantages in performance, cost, power efficiency, and scalability.
L3C creates a smarter, more efficient way to connect lasers to photonic chips—unlocking better performance while making systems easier and more cost-effective to build.
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